Product Overview
JPR high purity lead-free tin/copper solder offers excellent solder joint reliability and superior joint strength. A cost effective general purpose solder with excellent thermal & mechanical fatigue resistance where low cleaning is required after solder joint.
- Appearance: Bright and shiny surface
- Alloy: Sn/Cu 0.7%
- Flux Content: 3.0±1.0%
- Halide Content: Under 0.5%
- Gravity: 7.3
- Spread Ability: >80%
- Packaging: 100gm/500gm reels
- Flux Type: ROL 1
